During Intel’s IDF 2015 developer conference, the company revealed a number of initiatives related to the IoT and connected devices. These included updates to Intel’s RealSense technology that will bring depth sensing to more devices and applications, and new collaborations for securing the Internet of Things (IoT), in addition to programs and toolkits for developers to help speed industrial IoT solutions to market. For wearable computing, there are new updates on the Intel Curie module.
And Intel announced a new reality competition program for 2016 called "America's Greatest Makers," produced by United Artists Media Group and appearing across networks and properties of Turner Broadcasting.
Highlights of the announcements include:
- Intel RealSense technology will be available on a wide-range of platforms, opening up more opportunities for developers to create new depth-sensing hardware and software. In addition to Windows and Android, developers will be able to use Intel RealSense technology with Mac OS X, ROS, Linux, Scratch 1, Unity, XSplit, OBS, Structure SDK, OSVR, Unreal Engine 4 and Google's Project Tango. Also, a number of developers, including Razer, XSplit and Savioke announced new platforms, peripherals and other solutions based on the Intel RealSense technology.
- In collaboration with Google, Intel is driving innovation in mobile depth sensing by combining Google's Project Tango and Intel RealSense technologies into an Android smartphone developer kit. The Intel RealSense Smartphone developer kit featuring Google's Project Tango enables new experiences, including indoor navigation and area learning, virtual reality, 3-D scanning, and more. The developer kit is targeted for release to a limited group of Android developers by the end of this year.
- Intel is collaborating with United Artists Media Group and Turner Broadcasting to create a reality competition called "America's Greatest Makers" that will premiere in the first half of 2016 and showcase makers competing for a $1 million prize by inventing wearable technology and smart connected consumer devices powered by the Intel Curie module.
- Intel introduced Intel Optane technology, which is based on the 3D XPoint non-volatile memory media and combined with the company's advanced system memory controller, interface hardware and software IP, to offer vast performance potential in a range of forthcoming products. Intel Optane technology will first come to market in a new line of high-endurance, high-performance Intel SSDs beginning in 2016. The new class of memory technology will also power a new line of Intel DIMMs designed for Intel's next-generation data center platforms.
- Intel announced a new software platform created specifically for the Intel Curie module, which includes all of the hardware, firmware, software and application SDK needed to enable a variety of device experiences. Intel IQ Software Kits will support future versions of this platform.
- Intel's Enhanced Privacy Identification (EPID) technology will be implemented by IoT sensor and micro controller vendors including Atmel and Microchip.
Read more: http://newsroom.intel.com/community/intel_newsroom...
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